about Soft and hard combination circuit boardThe production process is as follows:
01 Acceptance of design plate
The factory engineering department accepts and checks the design board documents sent by the customer.
The inspection includes: whether the design document is appropriate, whether the layer is missing, whether the document has a border, whether the drilling document exists, etc.
If the design is defective, the Engineering Department will notify the designer to modify it. If there is no design problem, mass production can be carried out according to the design.
02 Print the design as transparencies
Print the checked design file on the transparencies.
Light is projected onto these films to expose the photoresist on the circuit board in a manner similar to exposure photos. This kind of circuit board design is like a movie, lifelike, especially vivid.
03 Cutting and edging of glass fiber
Select the fiberglass and cut and grind it.
Select FR-4 glass fiber with copper plating on the top and bottom layers, and then cut the design size on the cutting machine. Because the edge of glass fiber is too rough, we need to polish its edge.
04 Inner layer fabrication
The top and bottom layers of glass fiber are covered with plastic dry film and hardened under ultraviolet radiation.
After the glass fiber is hardened with dry film on both sides, it is pressed together with a machine to effectively prevent copper from being dissolved by alkaline liquid in the subsequent process.
05 Etching process
The purpose of the entire etching process is to remove the excess copper and photoresist from the copper plate, and complete the prototype of PCB through a series of processes.
Remove the excess copper and photoresist from the laminated glass fiber, and complete the etching process after soaking with alkaline solution, and then complete the entire etching process through peeling, washing, drying and drying.
06 AOI and PP
The purpose of automatic optical inspection is to check the etching of the inner layer and ensure that all the etching of the inner layer is correct.
The clip vacuum is to apply a yellow epoxy like patch to the side of the board to increase the adhesion.
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Release time：2022-12-13
