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22-layer high speed communication backplane is one of the series of high level PCBs developed and produced by Shenzhen Dafengwang Electronics Co. Mainly used in 5G base stations and other fields, this PCB board is made of TU883 material with gold-sunk surface process.
Layer:22L
Material: TU883
Plate thickness:3.0
Copper thickness:1oz
Surface treatment: Immersion gold
Outer layer line width/line spacing:0.075/0.075um
Minimum hole diameter:0.25
Solder resist character color: green oil white character
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.qmuq.cn
