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This HDI board is widely used in semiconductor test field.
Layer:8L
Material: raw benefit S1000-2M
Plate thickness:4.4±0.4mm
Copper thickness:1oz
Surface treatment: sunken gold thickness: 0.05um
Outer layer line width/line spacing:127/85um
Minimum hole diameter: laser hole: 0.1mm; mechanical hole: 0.3mm, hole diameter ratio: 15:1
Solder blocking character color:red oil white character
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