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3rd order HDI blind buried hole circuit board is one of the HDIPCB blind buried hole boards developed and produced by Shenzhen Dafengwang Electronics Co. It is made of Sheng Yi A1000-2M material and produced with gold sinking process on the surface, the product is widely used in POS and other financial products.
Layer:8L
Material: Sheng Yi A1000-2M
Plate thickness:2.5±0.25mm
Copper thickness:1oz
Surface treatment: sunken gold, thickness 0.05um
Outer layer line width/line spacing:127/127um
Minimum aperture: laser blind hole 0.1mm. mechanical hole 0.25mm. aperture ratio 10:1
Solder blocking character color: black oil white character
Email: coco@dfwdz.com
Address: 615, Building A, No. 8, Xinhe Avenue, Xinqiao Community, Xinqiao Street, Baoan District, Shenzhen Shenzhenwebsite:www.qmuq.cn
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